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Turnkey PCB Assembly & Electronic Manufacture Services

PCB Manufacture Blog
PCB Types and Introduction of PCB
The Differences of Rigid PCB, Flex PCB and Rigid-Flex PCB
How Your PCB Manufactured?
About Flying Probe Test for PCB
PCB Surface Finishes Introduction and Comparison
Introduction of Copper Clad Laminate (CCL)
PCB Assembly Blog
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Is it OK with Soldering by hand in SMT Assembly Manufacturing Process?
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly


When you visit a PCBA Manufacturer in China you may ask the engineer or the engineer will tell you why the component would have needed to be baked before reflow soldering. 


In general, the reason for baking a component is to carefully remove all the moisture from the plastic part of the component. When a SMT component goes through a reflow oven, the temperature of the component (obviously) rises very quickly, causing any moisture inside to turn into steam. If without process of baking, it may lead some problems during inspection such as cold soldering. 


When we need to bake the component?


1. No need bake if component with sealed vacuum bags. 


2. If the relative humidity level is over 20% showed on humidity indicator when open the bags then component require baking. 


3. If the component exposed over 72 hours (bag opened) before reflow soldering then component require baking. 


4. If the component packed with other kind bags but not vacuum bags and without humidity indicator then component require baking. 


5. The recommended bake humidity for component in is 10%, the recommended bake time is 48 hours. 




1. The lifespan of component is 12 months under sealed vacuum bags. 


2. After opening the bag, in conditions of 30℃ & 60%RH, the component need bake before reflow soldering if based on below situation (see table)


IPC/JEDEC J-STD-20 provides Moisture Sensitivity Level


MSL 6 – Mandatory Bake before use 

MSL 5A – 24 hours 

MSL 5 – 48 hours

MSL 4 – 72 hours

MSL 3 – 168 hours

MSL 2A – 4 weeks 

MSL 2 – 1 year 

MSL 1 – Unlimited


3. If the sealed bags opened however no need production at that moment then the component need to be stored in the drying oven instantly (in conditions relative humidity below 20%).

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  • Skype: Downey.Jin_PCB&PCBA
  • Address: NO.40 LiYe Road, Songgang Street
  • Baoan District, Shenzhen, China

About us

  • Based in Shenzhen China, AgePCB provide 1-48Layer PCB and
    PCB assembly services from quick prototype to big production.
  • PCB Fab compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "PCB Assembly In High Quality For Ages".
    Choose us, you will have your best PCB and assembly partner.


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